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XC3S250E-4FTG256I AI Analysis:
Datasheet, Specs, Alternatives & ECAD

AI summary

XC3S250E-4FTG256I product

XC3S250E-4FTG256I

FPGAs (Field Programmable Gate Array)

Spartan-3EXC3S250EFPGAFTG256industrial

XC3S250E-4FTG256I is an industrial-grade Spartan-3E FPGA in a 256-ball FTG256 package, providing configurable logic, block RAM, multipliers, and clock-management resources.

Best for

  • Configurable digital logic
  • Industrial-temperature FPGA designs
  • Designs needing embedded block RAM and hardware multipliers

Avoid if

  • A currently verified lifecycle or compliance declaration is required
  • The board cannot support the FTG256 BGA footprint and associated power rails

Check before use

  • Validate I/O-bank VCCO requirements and assigned I/O standards
  • Verify configuration interface connections and CCLK signal integrity
  • Run implementation timing with the intended -4 speed grade

Key specifications

Logic capacity
5,508 equivalent logic cells
Block RAM
216 Kbit in 12 blocks
Multipliers
12 × 18 × 18
Package
FTG256, 256-ball BGA
Temperature range
-40°C to 100°C junction temperature

Compliance & Environment

RoHS
ROHS3 Compliant

Application

Industrial programmable logicEmbedded digital control

Datasheet

ds312.pdf

800 KB

Datasheet AI

CAD Models

Download ECAD models for XC3S250E-4FTG256I: KiCad symbol & footprint, Altium footprint, PCB footprint, and 3D model.

EDA Symbol
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PCB Footprint
Land pattern for PCB layout
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3D Model
STEP file for mechanical design
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KiCad Library
Verified KiCad 8 symbol, footprint, and 3D model
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Where to Buy

Real-time and catalog pricing from verified distributors

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Alternative components

Alternatives are being enriched. Analyze this part in PartGenie for the latest matches.

Design and risk insights

Questions & answers

It is an AMD Xilinx Spartan-3E XC3S250E FPGA with -4 speed grade and industrial junction-temperature rating, supplied in an FTG256 256-ball fine-pitch thin BGA package.