It is a Xilinx Spartan-3AN FPGA in the 256-ball FTG256 package. The XC3S400AN integrates FPGA logic with 4 Mb of in-system SPI Flash memory for configuration and nonvolatile application data.
XC3S400AN-4FTG256I AI Analysis:
Datasheet, Specs, Alternatives & ECAD
AI summary
Key specifications
- Logic capacity
- 8,064 logic cells; 3,584 slices
- Integrated Flash
- 4 Mb in-system SPI Flash
- Block RAM
- 360 Kb
- User I/O
- Up to 195 I/Os in FTG256
- Package
- 256-ball FTG256, 17 mm × 17 mm × 1.55 mm
- Temperature range
- -40 °C to 100 °C junction, industrial
Compliance & Environment
- RoHS
- ROHS3 Compliant
Application
Industrial control logicEmbedded processing and code storageNonvolatile FPGA configuration
Datasheet
CAD Models
Download ECAD models for XC3S400AN-4FTG256I: KiCad symbol & footprint, Altium footprint, PCB footprint, and 3D model.
EDA Symbol
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PCB Footprint
Land pattern for PCB layout
3D Model
STEP file for mechanical design
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Alternative components
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