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XC3S700AN-4FGG484I AI Analysis:
Datasheet, Specs, Alternatives & ECAD

AI summary

XC3S700AN-4FGG484I product

XC3S700AN-4FGG484I

FPGAs (Field Programmable Gate Array)

Spartan-3ANFPGAintegrated FlashFGG484industrial

XC3S700AN-4FGG484I is an industrial-temperature Spartan-3AN FPGA with integrated 8 Mbit nonvolatile Flash and a 484-ball FBGA package.

Best for

  • Industrial FPGA designs requiring integrated nonvolatile configuration memory
  • Applications needing up to 372 user I/O

Avoid if

  • The PCB cannot support a 484-ball, 1.0 mm pitch FBGA
  • A newer FPGA family or current toolchain support is required

Check before use

  • Validate I/O standards and VCCO assignments per bank
  • Verify Flash capacity and MultiBoot configuration requirements
  • Confirm availability and approved-source requirements

Key specifications

Logic cells
13,248
Block RAM
360 Kbits
User I/O
372 maximum
Integrated Flash
8 Mbits
Package
FGG484, 23 mm × 23 mm × 2.60 mm

Compliance & Environment

RoHS
ROHS3 Compliant
REACH
-
MSL
-
ECCN
-
HTSUS
-

Application

Industrial controlEmbedded nonvolatile FPGA systems

Datasheet

ds557.pdf

800 KB

Datasheet AI

CAD Models

Download ECAD models for XC3S700AN-4FGG484I: KiCad symbol & footprint, Altium footprint, PCB footprint, and 3D model.

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PCB Footprint
Land pattern for PCB layout
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3D Model
STEP file for mechanical design
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Where to Buy

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Alternative components

Alternatives are being enriched. Analyze this part in PartGenie for the latest matches.

Design and risk insights

Questions & answers

It is a Spartan-3AN FPGA from AMD Xilinx. The device combines programmable logic with integrated SPI Flash for configuration and nonvolatile application data.