XC7K325T-1FFG676I AI Analysis:
Datasheet, Specs, Alternatives & ECAD

AI summary

XC7K325T-1FFG676I product

XC7K325T-1FFG676I

FPGAs (Field Programmable Gate Array)

Kintex-7FPGAXC7K325TFFG676IndustrialGTXPCIe Gen2DSP

XC7K325T-1FFG676I is an industrial-grade Kintex-7 FPGA in a 27 mm × 27 mm FFG676 package, intended for substantial programmable logic, DSP, PCIe Gen2, and GTX serial-interface designs.

Best for

  • High-density programmable logic
  • DSP-intensive FPGA designs
  • PCIe Gen2 interfaces
  • Multi-gigabit serial connectivity

Avoid if

  • A design requires confirmed lifecycle or long-term supply information not provided in the source
  • The design requires package dimensions or height beyond the stated 27 mm × 27 mm footprint

Check before use

  • Confirm the exact FFG676 pinout and bank assignments
  • Confirm -1 industrial speed-grade timing requirements
  • Validate GTX lane requirements for the selected package
  • Review power, thermal, configuration, and signal-integrity requirements

Key specifications

Logic cells
326,080
DSP slices
4,000
Block RAM
16,020 Kb
GTX transceivers
16
Package
FFG676, 27 mm × 27 mm, 1.0 mm ball pitch

Compliance & Environment

RoHS
ROHS3 Compliant
REACH
-
MSL
-
ECCN
-
HTSUS
-

Application

Industrial FPGA systemsDSP processingPCI Express interfaces

CAD Models

Download ECAD models for XC7K325T-1FFG676I: KiCad symbol & footprint, Altium footprint, PCB footprint, and 3D model.

EDA Symbol
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PCB Footprint
Land pattern for PCB layout
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3D Model
STEP file for mechanical design
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KiCad Library
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Where to Buy

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Alternative components

Alternatives are being enriched. Analyze this part in PartGenie for the latest matches.

Design and risk insights

Questions & answers

It is an AMD/XILINX Kintex-7 FPGA based on the XC7K325T device, supplied in the FFG676 flip-chip package with -1 industrial temperature grading.