XDM200C-2-12-Z-2.8-G1 AI Analysis:
Datasheet, Specs, Alternatives & ECAD

AI summary

XDM200C-2-12-Z-2.8-G1 product

XDM200C-2-12-Z-2.8-G1

Component

2.00 mm pitchdual rowstraight pinround pinthrough holegold plated

A 2.00 mm-pitch, dual-row straight round-pin header identified as a 12-pin G1 gold-plated variant with 2.8 mm plastic height.

Best for

  • 2.00 mm pitch through-hole interconnects
  • Dual-row board connector layouts

Avoid if

  • A confirmed RoHS or REACH declaration is mandatory
  • The exact XDM200C drawing-family relationship has not been verified

Check before use

  • Confirm exact part-family drawing applicability
  • Confirm pin count and mating connector
  • Verify footprint hole diameter and row arrangement

Key specifications

Pitch
2.00 mm
Rows
Dual row
Current rating
2.00 A
Operating temperature
-40 °C to +105 °C
Contact plating
G1: 1 µin gold over nickel

Compliance & Environment

RoHS
-
REACH
-
MSL
-
ECCN
-
HTSUS
-

Application

Board-to-board interconnectsGeneral through-hole connector assemblies

CAD Models

Download ECAD models for XDM200C-2-12-Z-2.8-G1: KiCad symbol & footprint, Altium footprint, PCB footprint, and 3D model.

EDA Symbol
Schematic symbol for your EDA tool
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PCB Footprint
Land pattern for PCB layout
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3D Model
STEP file for mechanical design
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KiCad Library
Verified KiCad 8 symbol, footprint, and 3D model
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Alternative components

Alternatives are being enriched. Analyze this part in PartGenie for the latest matches.

Design and risk insights

Questions & answers

It is a XUNDA dual-row round-pin header with 2.00 mm pitch. The ordering code denotes straight Z pins, a 12-pin designation, 2.8 mm plastic height, and G1 1 µin gold plating.