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XDWF-0125WT-03P AI Analysis:
Datasheet, Specs, Alternatives & ECAD

AI summary

XDWF-0125WT-03P product

XDWF-0125WT-03P

Rectangular Connectors

ConnectorWaferSMT1.25mm Pitch

The XDWF-0125WT-03P is a 3-pin, 1.25mm pitch horizontal SMT wafer connector designed for wire-to-board applications, offering a 2A current rating and reliable performance in temperatures from -40°C to +85°C.

Best for

  • Compact wire-to-board PCB connections

Avoid if

  • High-vibration environments without strain relief

Check before use

  • PCB footprint compatibility

Key specifications

Pitch
1.25 mm
Current Rating
2 A
Pins
3

Compliance & Environment

RoHS
Compliant
REACH
-
MSL
-
ECCN
-
HTSUS
-

Application

Consumer ElectronicsIndustrial Control

Datasheet

3922d8f1ebba45cda2b543c3f4694ba8_2310181451_Lian-Xin-Technology-XDWF-0125WT-03P_C7527564.pdf

800 KB

Datasheet AI

CAD Models

Download ECAD models for XDWF-0125WT-03P: KiCad symbol & footprint, Altium footprint, PCB footprint, and 3D model.

EDA Symbol
Schematic symbol for your EDA tool
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PCB Footprint
Land pattern for PCB layout
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3D Model
STEP file for mechanical design
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KiCad Library
Verified KiCad 8 symbol, footprint, and 3D model
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Alternative components

Alternatives are being enriched. Analyze this part in PartGenie for the latest matches.

Design and risk insights

Questions & answers

It is a 3-pin horizontal SMT wafer connector with a 1.25mm pitch, commonly used in wire-to-board connections.