XG-T-GOLD is a 2.54 mm-pitch connector crimp terminal made from phosphor bronze. It is specified for use in DLL DL25413-Y series wire-to-board housings.
XG-T-GOLD AI Analysis:
Datasheet, Specs, Alternatives & ECAD
AI summary
Key specifications
- Wire range
- 26-22 AWG
- Insulation diameter
- 0.8-1.9 mm
- Material
- Phosphor bronze
- Plating
- Partial gold plating, 2 µin
- Compatible housing
- DL25413-Y series
Compliance & Environment
- RoHS
- -
- REACH
- -
- MSL
- -
- ECCN
- -
- HTSUS
- -
Application
Wire-to-board harnessesGeneral electronic interconnects
Datasheet
CAD Models
Download ECAD models for XG-T-GOLD: KiCad symbol & footprint, Altium footprint, PCB footprint, and 3D model.
EDA Symbol
Schematic symbol for your EDA tool
PCB Footprint
Land pattern for PCB layout
3D Model
STEP file for mechanical design
KiCad Library
Verified KiCad 8 symbol, footprint, and 3D model
Alternative components
Alternatives are being enriched. Analyze this part in PartGenie for the latest matches.
