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XSD1226-307 AI Analysis:
Datasheet, Specs, Alternatives & ECAD

AI summary

XSD1226-307 product

XSD1226-307

Office Supplies

Heat SinkAluminumThermal Management

The XSD1226-307 is a 20x14x20mm 6063-T5 aluminum heat sink designed for efficient thermal management in electronic devices.

Best for

  • Small-scale electronics cooling
  • PCB-mounted thermal management

Avoid if

  • High-power applications requiring large surface area heat sinks

Check before use

  • Mechanical clearance on the PCB
  • Thermal resistance requirements

Key specifications

Material
6063-T5 Aluminum
Dimensions
20 x 14 x 20 mm
Finish
Natural Wash

Compliance & Environment

RoHS
Compliant
REACH
-
MSL
-
ECCN
-
HTSUS
-

Application

Electronics Cooling

Datasheet

29b9a72147330e62106e043b97cb4e38_1811021923_XSD-XSD1226-307_C286232.pdf

800 KB

Datasheet AI

CAD Models

Download ECAD models for XSD1226-307: KiCad symbol & footprint, Altium footprint, PCB footprint, and 3D model.

EDA Symbol
Schematic symbol for your EDA tool
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PCB Footprint
Land pattern for PCB layout
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3D Model
STEP file for mechanical design
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KiCad Library
Verified KiCad 8 symbol, footprint, and 3D model
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Alternative components

Alternatives are being enriched. Analyze this part in PartGenie for the latest matches.

Design and risk insights

Questions & answers

It is a compact aluminum heat sink (20x14x20mm) made from 6063-T5 alloy, featuring a single-pin mounting design.