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XSD1226-312 AI Analysis:
Datasheet, Specs, Alternatives & ECAD

AI summary

XSD1226-312 product

XSD1226-312

Office Supplies

Heat SinkAluminumThermal Management

The XSD1226-312 is a 20x20x6.3mm aluminum heat sink manufactured by XSD, suitable for general thermal management in electronic devices.

Best for

  • General electronic cooling
  • Small form factor PCB applications

Avoid if

  • High-power applications requiring active cooling or larger surface area

Check before use

  • Thermal resistance requirements
  • Mounting method

Key specifications

Material
6063-T5 Aluminum
Dimensions
20 x 20 x 6.3 mm
Surface
Natural Washed White

Compliance & Environment

RoHS
-
REACH
-
MSL
-
ECCN
-
HTSUS
-

Application

General Electronics

Datasheet

3e7078391fe8d3197d79126d2e930713_1811021923_XSD-XSD1226-312_C286224.pdf

800 KB

Datasheet AI

CAD Models

Download ECAD models for XSD1226-312: KiCad symbol & footprint, Altium footprint, PCB footprint, and 3D model.

EDA Symbol
Schematic symbol for your EDA tool
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PCB Footprint
Land pattern for PCB layout
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3D Model
STEP file for mechanical design
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KiCad Library
Verified KiCad 8 symbol, footprint, and 3D model
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Alternative components

Alternatives are being enriched. Analyze this part in PartGenie for the latest matches.

Design and risk insights

Questions & answers

It is a 20mm x 20mm x 6.3mm aluminum heat sink made from 6063-T5 alloy, designed for cooling electronic components.