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XSD309-067 AI Analysis:
Datasheet, Specs, Alternatives & ECAD

AI summary

XSD309-067 product

XSD309-067

Programmers

HeatsinkAluminumThermal Management

The XSD309-067 is a 6063-T5 aluminum heatsink measuring 16.5mm x 16mm x 25mm, designed for effective heat dissipation in electronic assemblies.

Best for

  • General thermal management
  • PCB-mounted power components

Avoid if

  • High-vibration environments without additional support
  • Applications requiring specific anodized colors

Check before use

  • Pin pitch and mounting hole alignment

Key specifications

Material
6063-T5 Aluminum
Dimensions
16.5 x 16 x 25 mm
Mounting
Dual Pin / M3

Compliance & Environment

RoHS
Compliant
REACH
-
MSL
-
ECCN
-
HTSUS
-

Application

Industrial ElectronicsPower Management

Datasheet

470e95491b5f15f4aa23da13bd20ecd8_1811072112_XSD-XSD309-067_C286228.pdf

800 KB

Datasheet AI

CAD Models

Download ECAD models for XSD309-067: KiCad symbol & footprint, Altium footprint, PCB footprint, and 3D model.

EDA Symbol
Schematic symbol for your EDA tool
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PCB Footprint
Land pattern for PCB layout
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3D Model
STEP file for mechanical design
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KiCad Library
Verified KiCad 8 symbol, footprint, and 3D model
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Alternative components

Alternatives are being enriched. Analyze this part in PartGenie for the latest matches.

Design and risk insights

Questions & answers

It is an aluminum heatsink (6063-T5) with a natural finish, designed for cooling electronic components.