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XSD57-067 AI Analysis:
Datasheet, Specs, Alternatives & ECAD

AI summary

XSD57-067 product

XSD57-067

Office Supplies

Heat SinkAluminum6063-T5

The XSD57-067 is a 6.8x6x6.8mm aluminum heat sink made from 6063-T5 alloy, suitable for small-scale electronic thermal management.

Best for

  • Small electronic components
  • PCB-level thermal management

Avoid if

  • High-power applications requiring significant surface area

Check before use

  • Thermal dissipation requirements

Key specifications

Material
6063-T5 Aluminum
Dimensions
6.8 x 6 x 6.8 mm
Finish
Natural Anodized

Compliance & Environment

RoHS
Compliant
REACH
-
MSL
-
ECCN
-
HTSUS
-

Application

General Electronics

Datasheet

328ca3dd7f4ee3a2dc985bf44ea2a682_1811021923_XSD-XSD57-067_C286221.pdf

800 KB

Datasheet AI

CAD Models

Download ECAD models for XSD57-067: KiCad symbol & footprint, Altium footprint, PCB footprint, and 3D model.

EDA Symbol
Schematic symbol for your EDA tool
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PCB Footprint
Land pattern for PCB layout
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3D Model
STEP file for mechanical design
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KiCad Library
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Alternative components

Alternatives are being enriched. Analyze this part in PartGenie for the latest matches.

Design and risk insights

Questions & answers

It is a compact aluminum heat sink (6063-T5) used for cooling electronic components.