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Z-B8104021000081 AI Analysis:
Specs, Applications & Alternatives

AI summary

Z-B8104021000081 product

Z-B8104021000081

Interconnects

IDC Housing2.54mm Pitch40-Pin

The Z-B8104021000081 is a 40-position (2x20) IDC housing with a 2.54mm pitch, designed for wire-to-board or wire-to-wire connectivity.

Best for

  • Wire-to-board connections
  • Wire-to-wire connections
  • General industrial electronics

Avoid if

  • High-vibration environments without strain relief
  • Applications requiring non-standard pitch

Check before use

  • Mating header compatibility
  • Wire gauge compatibility for IDC terminals

Key specifications

Pitch
2.54 mm
Positions
40 (2x20)
Material
PBT+30%GF

Compliance & Environment

RoHS
-
REACH
-
MSL
-
ECCN
-
HTSUS
-

Application

IndustrialGeneral Connectivity

Datasheet

9ab73de0303736903137538e4f53a0a1_2405280910_Nextron-Nextronics-Engineering-Z-B8104021000081_C220913.pdf

800 KB

Datasheet AI

CAD Models

EDA symbol, PCB footprint, and 3D model for this component. Supported tools include Altium, KiCad, Eagle, and more.

EDA Symbol
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PCB Footprint
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3D Model
STEP file for mechanical design
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Where to Buy

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Alternative components

Alternatives are being enriched. Analyze this part in PartGenie for the latest matches.

Design and risk insights

Questions & answers

It is a 2.54mm pitch IDC (Insulation Displacement Connector) housing with 40 positions arranged in two rows of 20.