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Z-B8106021000081 AI Analysis:
Datasheet, Specs, Alternatives & ECAD

AI summary

Z-B8106021000081 product

Z-B8106021000081

Interconnects

IDC Housing2.54mm Pitch60-Pin

The Z-B8106021000081 is a 2.54mm pitch, 60-position (2x30) IDC housing from Nextron, suitable for wire-to-board and wire-to-wire interconnects.

Best for

  • Wire-to-board connections
  • Ribbon cable termination

Avoid if

  • High-vibration environments without strain relief
  • Applications requiring non-standard pitch

Check before use

  • Mating header compatibility
  • Wire gauge compatibility with IDC contacts

Key specifications

Pitch
2.54 mm
Positions
60 (2x30)
Material
PBT+30%GF

Compliance & Environment

RoHS
Compliant
REACH
-
MSL
-
ECCN
-
HTSUS
-

Application

Industrial ControlConsumer Electronics

Datasheet

91510ea775b2956307a77343c4786403_2405280910_Nextron-Nextronics-Engineering-Z-B8106021000081_C220915.pdf

800 KB

Datasheet AI

CAD Models

Download ECAD models for Z-B8106021000081: KiCad symbol & footprint, Altium footprint, PCB footprint, and 3D model.

EDA Symbol
Schematic symbol for your EDA tool
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PCB Footprint
Land pattern for PCB layout
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3D Model
STEP file for mechanical design
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KiCad Library
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Where to Buy

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Alternative components

Alternatives are being enriched. Analyze this part in PartGenie for the latest matches.

Design and risk insights

Questions & answers

It is a dual-row IDC (Insulation Displacement Connector) housing with 60 positions (2x30) and a 2.54mm pitch.