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ZX-HY2.0-DZ AI Analysis:
Datasheet, Specs, Alternatives & ECAD

AI summary

ZX-HY2.0-DZ product

ZX-HY2.0-DZ

Interconnects

Crimp Terminal2.0mm PitchWire-to-Board

The ZX-HY2.0-DZ is a 2.0mm pitch crimp terminal by Megastar, suitable for wire-to-board connections using AWG#30-#24 wires.

Best for

  • Internal wire-to-board connections
  • High-density electronic assemblies

Avoid if

  • High-vibration environments without proper strain relief
  • Applications requiring gold-plated contacts

Check before use

  • Crimp tool compatibility
  • Housing series matching

Key specifications

Pitch
2.0 mm
Wire Range
AWG#30 - #24
Material
Phosphor Bronze
Plating
Tin

Compliance & Environment

RoHS
Compliant
REACH
-
MSL
-
ECCN
-
HTSUS
-

Application

Consumer ElectronicsIndustrial Control

Datasheet

26f43a987e052e5b32df5f6a315261bc_2307121414_Megastar-ZX-HY2-0-DZ_C7462721.pdf

800 KB

Datasheet AI

CAD Models

Download ECAD models for ZX-HY2.0-DZ: KiCad symbol & footprint, Altium footprint, PCB footprint, and 3D model.

EDA Symbol
Schematic symbol for your EDA tool
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PCB Footprint
Land pattern for PCB layout
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3D Model
STEP file for mechanical design
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KiCad Library
Verified KiCad 8 symbol, footprint, and 3D model
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Where to Buy

Real-time and catalog pricing from verified distributors

Live prices updated on demand · Catalog (~) prices may differ

Alternative components

Alternatives are being enriched. Analyze this part in PartGenie for the latest matches.

Design and risk insights

Questions & answers

The ZX-HY2.0-DZ is a tin-plated phosphor bronze crimp terminal designed for 2.0mm pitch wire-to-board connector systems.