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ZX-MX3.0-2-3P-HGJK AI Analysis:
Datasheet, Specs, Alternatives & ECAD

AI summary

ZX-MX3.0-2-3P-HGJK product

ZX-MX3.0-2-3P-HGJK

Interconnects

3.0mm PitchMale Header6-Position

The ZX-MX3.0-2-3P-HGJK is a 6-position (2x3) dual-row male header housing with a 3.0mm pitch, suitable for general-purpose wire-to-board connections.

Best for

  • Wire-to-board connectivity
  • General industrial electronics

Avoid if

  • High-vibration environments without strain relief
  • Applications exceeding 5A current

Check before use

  • Mating connector compatibility

Key specifications

Positions
6 (2x3)
Pitch
3.0 mm
Current Rating
5 A

Compliance & Environment

RoHS
Compliant
REACH
-
MSL
-
ECCN
-
HTSUS
-

Application

General Connectivity

Datasheet

9bebfd3f023bfc71e6a8af62e2a05210_2308250933_Megastar-ZX-MX3-0-2-3P-HGJK_C7541626.pdf

800 KB

Datasheet AI

CAD Models

Download ECAD models for ZX-MX3.0-2-3P-HGJK: KiCad symbol & footprint, Altium footprint, PCB footprint, and 3D model.

EDA Symbol
Schematic symbol for your EDA tool
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PCB Footprint
Land pattern for PCB layout
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3D Model
STEP file for mechanical design
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KiCad Library
Verified KiCad 8 symbol, footprint, and 3D model
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Where to Buy

Real-time and catalog pricing from verified distributors

Live prices updated on demand · Catalog (~) prices may differ

Alternative components

Alternatives are being enriched. Analyze this part in PartGenie for the latest matches.

Design and risk insights

Questions & answers

It is a 6-position dual-row male header housing with a 3.0mm pitch, designed for wire-to-board electrical connections.